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Thermal analyzer based on RC-network models, adapted for 3D-ICs by Boston University
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IFTE-EDA/HotSpot
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LICENSE ------- LICENSE TERMS Copyright (c)2003-2015. All rights reserved. Permission is hereby granted, without written agreement and without license or royalty fees, to use, copy, modify, and distribute this software and its documentation for any purpose, provided that the above copyright notice and the following four paragraphs appear in all copies of this software, whether in binary form or not. IN NO EVENT SHALL THE AUTHORS, THE UNIVERSITY OF VIRGINIA, OR THE STATE OF VIRGINIA BE LIABLE TO ANY PARTY FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF THIS SOFTWARE AND ITS DOCUMENTATION, EVEN IF THEY HAVE BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. THE AUTHORS, THE UNIVERSITY OF VIRGINIA, AND THE STATE OF VIRGINIA SPECIFICALLY DISCLAIM ANY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. THE SOFTWARE PROVIDED HEREUNDER IS ON AN "AS IS" BASIS, AND THE AUTHORS HAVE NO OBLIGATION TO PROVIDE MAINTENANCE, SUPPORT, UPDATES, ENHANCEMENTS, OR MODIFICATIONS. NEITHER THE NAME OF ANY VIRGINIA ENTITY NOR THE NAMES OF THE CONTRIBUTORS MAY BE USED TO ENDORSE OR PROMOTE PRODUCTS DERIVED FROM THIS SOFTWARE WITHOUT SPECIFIC PRIOR WRITTEN PERMISSION. If you use this software or a modified version of it, we would appreciate it if you would cite one of the following papers: 1) K. Skadron, M. R. Stan, W. Huang, S. Velusamy, D. Tarjan, and K. Sankaranarayanan, "Temperature-Aware Microarchitecture." In Proceedings of the 30th International Symposium on Computer Architecture, June 2003 2) W. Huang, M. R. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, and S. Velusamy, "Compact Thermal Modeling for Temperature-Aware Design." In Proceedings of the 41st Design Automation Conference, June 2004. 3) K. Sankaranarayanan, S. Velusamy, M. R. Stan, and K. Skadron, "A Case for Thermal-Aware Floorplanning at the Microarchitectural Level.", Journal of Instruction-Level Parallelism, June 2005. 4) W. Huang, K. Sankaranarayanan, R. J. Ribando, M. R. Stan, and K. Skadron, "Accurate, Pre-RTL Temperature-Aware Processor Design Using a Parameterized, Geometric Thermal Model Considerations." IEEE Transactions on Computers, 57(9):1277-88, September 2008. 5) W. Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, and M. R. Stan, "Differentiating the Roles of IR Measurement and Simulation of Power and Temperature-Aware Design" In Proceedings of the 2009 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS). April. 2009 6) R. Zhang, M. R. Stan, and K. Skadron, "HotSpot 6.0: Validation, Acceleration and Extension." University of Virginia, Tech. Report CS-2015-04
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